Rogers TMM4 Microwave Printed Circuit Board 15mil 20mil 25mil 30mil 50mil 60mil With Immersion Gold
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Rogers TMM4 Microwave Material Overview
Rogers TMM4 is a thermoset microwave material that combines ceramic, hydrocarbon, and thermoset polymer composites, specifically designed for high reliability in plated-through-hole applications, including stripline and microstrip configurations. It features a dielectric constant of 4.70, offering a blend of electrical and mechanical properties that harness the advantages of both ceramic and traditional PTFE microwave materials, while eliminating the need for specialized production techniques. Notably, TMM4 does not require sodium naphthanate treatment prior to electroless plating.
Key Properties
Thermal Coefficient of Dielectric Constant: Exceptionally low, typically less than 30 PPM/°C.
Coefficient of Thermal Expansion: Isotropic and closely matched to copper, ensuring reliable plated-through holes and minimal etch shrinkage values.
Thermal Conductivity: Approximately twice that of conventional PTFE/ceramic materials, which aids in heat removal.
Thermoset Resins: TMM4 does not soften when heated, allowing for safe wire bonding of component leads to circuit traces without the risk of pad lifting or substrate deformation.
PCB Capability (TMM4)
PCB Material: |
Composite of Ceramic, hydrocarbon and thermoset polymer |
Designator: |
TMM4 |
Dielectric constant: |
4.5 ±0.045 (process); 4.7 (design) |
Layer count: |
Single Sided, Double Sided, Multi-layer, Hybrid designs |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.810mm), 200mil (5.08mm), 250mil (6.35mm), 500mil (12.7mm) |
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Typical Applications
Chip testers
Dielectric polarizers and lenses
Filters and couplers
Global Positioning System (GPS) antennas
Patch antennas
Power amplifiers and combiners
RF and microwave circuitry
Satellite communication systems
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Data Sheet of TMM4
TMM4 Typical Value |
||||||
Property |
TMM4 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
4.5±0.045 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Dielectric Constant,εDesign |
4.7 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor (process) |
0.002 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Thermal Coefficient of dielectric constant |
+15 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
|
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
|
Volume Resistivity |
6 x 108 |
- |
Mohm.cm |
- |
ASTM D257 |
|
Surface Resistivity |
1 x 109 |
- |
Mohm |
- |
ASTM D257 |
|
Electrical Strength(dielectric strength) |
371 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
|
Thermal Properties |
||||||
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
|
Coefficient of Thermal Expansion - X |
16 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Y |
16 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Z |
21 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Thermal Conductivity |
0.7 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
|
Mechanical Properties |
||||||
Copper Peel Strength after Thermal Stress |
5.7 (1.0) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
|
Flexural Strength (MD/CMD) |
15.91 |
X,Y |
kpsi |
A |
ASTM D790 |
|
Flexural Modulus (MD/CMD) |
1.76 |
X,Y |
Mpsi |
A |
ASTM D790 |
|
Physical Properties |
||||||
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.07 |
- |
% |
D/24/23 |
ASTM D570 |
3.18mm (0.125") |
0.18 |
|||||
Specific Gravity |
2.07 |
- |
- |
A |
ASTM D792 |
|
Specific Heat Capacity |
0.83 |
- |
J/g/K |
A |
Calculated |
|
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
|